Nanoimprint Mold Fabrication Process and High Durability Release Agent
Nanoimprint lithography (NIL): Our technique is novel and challenging technology, so variety applications are expected.
Thermostable silane couping agent for nanoimprinting: This is the novel and high durability and high thermosatble release agent for NIL. In particular, this release agent can use for electroplating nickel mold.
Applied technology:
Nanoimprint: Optical devices, Plasmon devices, Bio
devices, Printed electronics,
Anti-reflection structure: FPD (Flat Panel Display) film,
Mobile phone display film
Thermostable silane couping agent for nanoimprinting: Release
agent for NIL
Nanoimprint lithography (NIL) is a powerful tool for nano-scale
fabrication. This process is nano-scale pattern transfer technique using
nano-patterned mold. The key issues of NIL are mold fabrication process
and release agent. We have been developed three-dimensional (3D) NIL
mold fabrication process and high durability release agent. Sub- 100 nm
3D mold and roll shape mold are fabricated by special electron beam
lithography technique. Anti-reflection structure (Moth-eye structure)
mold is fabricated by ion beam bombardment. This process is rapid and
can fabricate large area mold. Fabricated anti-reflection structure has
less than 0.1% reflectivity at visible wave length. The surface
roughness of this structure is very high, thus anchor effect prevents
release. In order to release this kind mold, novel fluorinate silane
coupling agent has been developed for NIL release agent. Using this
release agent, high aspect ratio anti-reflection structure can be
transferred by NIL. This kind high aspect ratio structure is useful for
optical devices, bio-devices (scaffold for cell culture) and so on.
Dr.
Jun Taniguchi, Associate Professor
Department of Electrical Engineering, Faculty of Industrial Science and Technology,
Tokyo University of Science

He received the BE, ME and PhD degrees from Tokyo
University of Science, in 1994, 1996 and 1999, respectively. From 1999
to 2009, he was with Faculty of Industrial Science and Technology, Tokyo
University of Science, Chiba, Japan. His research interest includes
electron beam lithography, nanoimprint lithography, and nanotecnology.
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